Principal Thin Films Engineer, Advanced Packaging

Micron Technology Principal Thin Films Engineer, Advanced Packaging YesterdaySaved In-Office Boise, ID, USA Senior level Senior levelArtificial Intelligence • Hardware • Information Technology • Machine LearningDevelop and optimize thin-film deposition processes for advanced semiconductor packaging and memory products. Characterize films, reduce process variability and costs, analyze failures, collaborate with integration and manufacturing teams, engage equipment vendors, maintain a pilot production line, and support technology transfer to manufacturing. The role also drives thin-film technology roadmaps, intellectual property generation, and production implementation.Top Skills: Ai AgentsDesign Of Experiments (Doe)Plasma ProcessingProcess AutomationSemiconductor Advanced PackagingStatistical AnalysisThin Film CharacterizationThin Film Deposition