Process Integration Engineer III

Applied Materials Process Integration Engineer III 58 Minutes AgoSaved In-Office 2 Locations 108K-149K Annually Mid level 108K-149K Annually Mid levelArtificial Intelligence • Semiconductor • ManufacturingDevelops semiconductor, photonic, quantum-device, and 3D integration processes and packaging solutions. Responsibilities include designing experiments, collecting and analyzing process and device data, characterizing hardware and materials, troubleshooting complex engineering issues, conducting root cause analyses, preparing technical documentation, and collaborating with engineering teams, customers, startups, universities, vendors, and suppliers to develop advanced technologies.Top Skills: 3D IntegrationAdvanced PackagingMaterials EngineeringMetrologyOptical Quantum ComputingPhotonic PlatformsQuantum StructuresRoot Cause AnalysisSemiconductor ProcessingSuperconducting Qubits