Physical Design Senior Engineer
Indexed description
Key Responsibilities
- Advanced Physical Implementation & Constraint Ownership
- Full-Flow Execution: Take technical ownership of the RTL-to-GDSII implementation, including Floorplanning, Place and Route (P&R), and Clock Tree Synthesis (CTS).
- Execution Strategy: Drive a "constraint-driven" approach to minimize iterations and ensure optimal physical results.
- Bottleneck Resolution: Analyze functional contexts to identify and resolve routing congestion and timing bottlenecks proactively.
- Constraint Maintenance: Hands-on management of SDC constraints at every stage; responsible for cleaning, regenerating, and validating timing constraints to ensure they reflect silicon reality (e.g., Multi-Cycle Paths, False Paths).
- Timing Closure & ECO Implementation
- Sign-off Focus: Deliver complex timing closure for designs with multiple clock domains and asynchronous interfaces using DMSA and OCV/AOCV/POCV techniques.
- Advanced ECO Execution: Implement Engineering Change Orders (ECO) at the gate level and propose physical-level adjustments when required to meet timing or power targets.
- Design Integrity: Perform and validate Signal Integrity (SI) and Power Integrity (IR-Drop/EM) analyses to ensure robust sign-off.
- Experience: 10+ years of professional experience in Semiconductor Physical Design and Digital Implementation.
- SDC Expertise: Expert knowledge of SDC format with the ability to write, debug, and manage complex constraints for Multi-Mode Multi-Corner (MMMC) designs.
- Timing & STA: Solid hands-on experience with STA tools (PrimeTime or Tempus) and managing violations in advanced technology nodes or critical environments (e.g., Automotive).
- CDC Knowledge: Proficiency in Clock Domain Crossing (CDC) analysis and verification.
- Automation Skills: Excellent scripting capabilities (Tcl, Python, or Perl) for flow automation and report analysis.
- RTL-to-GDSII Integration: Proven experience interfacing with Front-End teams to optimize RTL for better physical synthesis and routability.
- Manufacturing & Reliability: Practical experience implementing DFM (Design for Manufacturing) rules and performing Yield analysis to ensure high-volume production stability.
- Advanced Power Methodologies: Hands-on experience with Low Power design flows using UPF or CPF, including the implementation of power-gating and multi-voltage domains.
- Domain-Specific Compliance: Familiarity with Automotive safety standards (ISO 26262), specifically regarding physical redundancy or electromigration (EM) requirements for mission-critical chips.
- Hierarchy & Partitioning: Experience managing large-scale hierarchical designs, including partitioning and top-level integration challenges.
- Join a highly innovative microelectronics company working at the forefront of RISC-V and advanced SoC technologies.
- Opportunity to play a key technical leadership role bridging industry and public research.
- Collaboration with top-tier research institutions and industrial partners across Europe.
- Flexible working conditions and hybrid work environment.
- Competitive remuneration aligned with seniority and expertise.
- Position based in Rome.
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