PCB Design & Hardware Engineer

We are looking for a PCB Design & Hardware Engineer to design and validate custom electronic boards for our low-power IoT and edge systems. You will work on battery and solar-powered devices operating in harsh Saharian environments, focusing on robust power management, reliable RF communication, and ruggedized PCB design. This role involves end-to-end ownership of PCB development, from schematic capture to prototyping and manufacturing support.

Responsibilities

• Design and develop 2–6 layer PCBs for IoT devices, focusing on low-power, rugged, and reliable operation.
• Create schematics and layouts using Altium Designer, KiCad, or Eagle.
• Design and optimize analog/digital circuits, RF layouts, and PCB grounding strategies.
• Ensure EMI/EMC compliance in board layouts.
• Design and validate battery management circuits (Li-Ion, Li-Po, LiFePO4) and solar charging solutions (MPPT, boost/buck converters).
• Implement reliable sensor/actuator interfaces using UART, SPI, I2C, ADC/DAC, GPIO.
• Develop PCBs with IP67/IP68 ruggedness for operation under heat, dust, and humidity.
• Collaborate with embedded engineers to ensure seamless hardware/software integration.
• Work with manufacturing partners to ensure DFM (Design for Manufacturing) and smooth production.
• Use simulation tools (SPICE, thermal analysis) to validate design choices.
• Support board bring-up, testing, and debugging in lab and field conditions.

• 3+ years in PCB design for low-power embedded and IoT systems.
• Proficiency in Altium Designer, KiCad, or Eagle.
• Strong background in analog/digital circuit design, RF design principles, power electronics.
• Experience with battery charging/discharging, BMS, solar charging circuits (MPPT, DC/DC converters).
• Experience designing hardware interfaces for UART, SPI, I2C, ADC/DAC, GPIO.
• Knowledge of IP67/IP68 standards for dust-proof, water-resistant, and high-temperature boards.
• Familiarity with PCB production processes, assembly constraints, and DFM best practices.
• Ability to run SPICE, thermal simulations, and signal integrity checks.

• Experience with LoRa modules (SX1276/1278) and custom RF antenna design/tuning.
• Knowledge of high-frequency PCB layout techniques.
• Familiarity with compliance testing (CE, FCC, IEC).
• Experience with rugged enclosures and thermal dissipation strategies.