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Platform Recruitment Linkedin · Posted 2d ago

Signal Integrity / Power Integrity Engineer

New York, United States

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Indexed description

Signal Integrity / Power Integrity Engineer

Location: New York, NY / Austin, TX / Boulder, CO / Chicago, IL (Onsite)

Salary: $200,000–$300,000 + Bonus

Type: Full-time, Permanent


My client, a leading quantitative trading firm, is looking for a Signal Integrity / Power Integrity Engineer to join its expanding Hardware team. The role focuses on delivering high-performance PCB and package designs for advanced ASIC platforms, covering high-speed SERDES, power delivery, packages, and PCBs.


Key Responsibilities

  • Develop SI/PI solutions for complex, high-performance system designs
  • Analyse and guide high-speed PCB, BGA and package designs from 28+ Gbps
  • Simulate and optimise SERDES channels, vias, connectors, sockets, stackups, routing and package interfaces
  • Develop SI guidelines, perform post-layout extraction and improve models against lab measurements
  • Analyse power delivery for ASICs drawing 500+ amps across PSUs, regulators, PCBs, capacitors, packages and dies
  • Automate simulation, analysis, data gathering and visualisation workflows
  • Collaborate with internal engineering teams and external design/layout partners throughout the design lifecycle


Requirements

  • MS/PhD in Electrical Engineering, Computer Engineering, Physics or related field, or equivalent experience
  • Strong experience in SI, PI, or both within high-performance electronics
  • Strong fundamentals in electromagnetics, transmission lines and PCB/package design
  • Experience with high-speed SERDES links at 28+ Gbps; PAM4 at 56/112+ Gbps preferred
  • Experience with high-current (>500A) ASIC power delivery
  • Proficiency with SI/PI CAE and circuit simulation tools such as HFSS, SIwave, Clarity 3D, Sigrity, ADS, SPICE, SIMPLIS or MATLAB
  • Python/scripting experience for automation, analysis or validation
  • Experience translating simulation results into robust, manufacturable PCB/package designs
  • Strong communication and collaboration skills


What’s on Offer

  • $200k–$300k base salary depending on experience and location
  • Discretionary performance-based bonus
  • Competitive benefits package
  • Onsite working in New York, Austin, Boulder or Chicago
  • Opportunity to work on advanced ASIC, PCB, SERDES and power-delivery systems
  • Highly technical environment with complex, performance-critical hardware challenges


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