Sr. Module Engineer, Hybrid Bonding

Applied Materials Sr. Module Engineer, Hybrid Bonding YesterdaySaved Hybrid Santa Clara, CA, USA 147K-203K Annually Senior level 147K-203K Annually Senior levelArtificial Intelligence • Semiconductor • ManufacturingDevelop and scale die-to-wafer hybrid bonding processes for advanced semiconductor packaging, including memory, chiplets, HBM, photonics, and 3D integration. Lead process optimization, integration, yield improvement, defect reduction, metrology, reliability testing, equipment development, and technology transfer. Collaborate with engineering, R&D, suppliers, and customers while providing technical leadership, publishing results, presenting progress, and mentoring junior personnel.Top Skills: 200 Mm Wafers300 Mm Wafers3D StackingAfmCmpCsamCu-Cu InterconnectsDie-To-Wafer BondingDielectric-Dielectric BondingDoeFib/SemHbmHtolHybrid BondingJmpMinitabOptical MetrologyPlasma ActivationProcess IntegrationSemiconductor ManufacturingStatistical Process ControlThermal CyclingX-Ray Inspection