Director, Technical Package Development

Micron Technology Director, Technical Package Development Reposted 3 Hours AgoSaved In-Office Boise, ID, USA Expert/Leader Expert/LeaderArtificial Intelligence • Hardware • Information Technology • Machine LearningLeads Micron’s global DRAM packaging organization, defining long-term technology strategy and delivering advanced packaging solutions including HBM, 3D integration, heterogeneous integration, and chiplets. The role oversees cross-functional product development through high-volume manufacturing, drives technology investments, develops customer and supplier partnerships, and leads digital transformation using AI, analytics, automation, and engineering productivity initiatives. It also requires building high-performing global teams and influencing business and technology direction.Top Skills: 2.5D Integration3D IntegrationAdvanced AnalyticsAdvanced InterconnectsArtificial IntelligenceAutomationChipletsData ScienceDdrDigital EngineeringHbmHeterogeneous IntegrationLpdramMachine LearningSemiconductor Packaging