Software and Engineering Graduate Roles - HP Solutions (HPS)
Indexed description
HP brings together a portfolio that spans printing, personal computing, software and services to serve more than 1 billion customers in over 170 countries. We are committed to fostering a diverse and inclusive workplace that attracts exceptional talent and to supporting our employees to succeed at all levels. We dream in over 35 languages and share one mission: to engineer experiences that amaze.
The Program
Our future success depends on the innovation and fresh ideas you bring to HP, Inc. We are hiring students and new graduates with a diverse set of skills and experiences to join us, across the different organizations that make us HP, Inc. Our new grad program is intended to help you learn and grow at HP, give you an opportunity to make an impact, and work with leading edge technology. At HP, you’ll use advanced tools and technology to tackle complex challenges that make a real impact on people’s lives.
The Team
HP Solutions (HPS) is a global organization within HP that helps customers unlock the full value of their technology investments through innovative solutions, services, and support. Leveraging HP's industry-leading portfolio of computing, print, and collaboration technologies, HPS enables organizations to create productive, connected, and secure workplace experiences. From deployment and lifecycle management to customer support and digital workplace solutions, HPS partners with customers at every stage of their technology journey to drive business outcomes, enhance employee experiences, and accelerate innovation.
Electrical Engineering
Skills Areas Were Seeking:
- Python, C, EE Design, FPGA, Basic 2D/3D Design - CAD, ASICS(both analog and digital), data conversions- ADC and DAC, DVM, oscilloscope, Logic analyzer
- Coding /Tools/Knowledge Areas: Coding/ Tools: Java, Python, C++, React JS, Node JS, RESTful and GraphQL APIs, Azure DevOps and AWS CodePipeline, RESTful and GraphQL APIs, Splunk observability tools, such as Real User Monitoring (RUM), Application Performance Monitoring (APM), and Log Observer.
- Mechanical Design, CAD, coding Python, C,
- Python, Splunk, SQL, Data Structures, Data Analysis, Automation and AI, Jira, Power BI, Excel and Data, forecasting, modeling, software development.
- Firmware/Software development, C++, GHE, GitHub, Debugging, Quality Testing, Software Development Lifecycle
- Python, Java Script, SQL, encryption algorithms, authentication protocols, firewalls, IDS/IPS systems, and attack vectors, Linux and Windows, and networking concepts; TCP/IP
- Apple and/or Android Mobile Application related languages such as Swift, Objective C, Kotlin, Java, etc.
- Software Quality Assurance (SQA), Coding Language(Understanding of code architecture: C, Python, Java), Agile Development (Lean, Scrum, DevOps), Project Management, Data Analysis and Reporting, Computer Architecture, Office365
- Ruby-on-Rails, Java, Angular, AWS, GO, , Familiarity with Test-Driven-Development, printing system architectures, embedded systems, client/server infrastructure, networking technologies, Windows, MAC, Linux operating systems
- Figma, Adobe Creative Suite
- Thermal Analysis, DSC TSC, thermodynamics, fluids, mechanics of materials , fluids, mechanics of materials Reliability testing knowledge, CAD, data center knowledge, electrical components
- Python, C++, Familiarity with scripting, algorithm development, and system engineering.
- Repair and maintenance of complex IC manufacturing equipment (pneumatics, robotics, electronics, software, vacuum theory, etc)
- Has completed or is in the process of completing a university degree or higher (bachelor’s degree or equivalent)
- Has completed the degree prior to the start date
- Has no more than 24 months of prior work experience professionally related to the graduate hire requisition they are applying to (not including internships, teaching assistance, research work, or military experience)
- No more than 12 months since graduation from a university program
- Able to obtain work authorization in the United States without requiring sponsorship in the future.
- Electrical Engineer
- Computer Science
- Mechanical Engineering
- Software Engineering
- Data Science
- Computer Engineering
- Project experience demonstrating strong analytical, modeling and research skills
- Strong executive-level presentation skills (storyboarding, development, and delivery)
- Demonstrable success in delivering results in a cross-functional team setting
- Ability to handle ambiguity and unstructured work situations
- Team player who supports others and leads executives and peers through logical reasoning and relationship development
- Strong public speaking and workshop/conversation-facilitation skills
- Demonstrated ability to shape and influence ideas and actions of others
- Working knowledge of MS PowerPoint and MS Excel
HP is an equal opportunity employer: https://www8.hp.com/h20195/v2/GetDocument.aspx?docname=c08129225
The base pay range for this role is $72,600 to $108,950 annually with additional opportunities for pay in the form of bonus and/or equity (applies to US candidates only). Pay varies by work location, job-related knowledge, skills, and experience.
Benefits
HP offers a comprehensive benefits package for this position, including:
- Health insurance
- Dental insurance
- Vision insurance
- Long term/short term disability insurance
- Employee assistance program
- Flexible spending account
- Life insurance
- Generous time off policies, including;
- 4-12 weeks fully paid parental leave based on tenure
- 11 paid holidays
- Additional flexible paid vacation and sick leave (US benefits overview)
Explore HP
Job -
Engineering
Schedule -
Full time
Shift -
No shift premium (United States of America)
Travel -
Relocation -
Equal Opportunity Employer (EEO) -
HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).
Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.
For more information, review HP’s EEO Policy or read about your rights as an applicant under the law here: “Know Your Rights: Workplace Discrimination is Illegal"
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