Director of Technical Leader for Advanced PBCA and System Integration-Guadalajara, Mexico

Responsibilities

• Lead the Development of Advanced PCBA / SI Mfg capabilities in the Mexico sites
• Collaborate and interact with customer technical team and Foxconn R&D to co-develop Test

Vehicle, Technical Spec/Checklist, Reliability Testing, DFM and Process for new assembly, rework

technology, component packaging and / or process material. Fostering strong and collaborative

relationships with clients and internal cross functional teams.

• Lead the Mfg technical team and work the labs at Mexico and global labs to perform all the process

and reliability evaluation regularly. .

• Support Foxconn central and other sites and BUs to share and develop new Advanced Mfg

Capabilities .

• Develop and mentor leaders to have good people skill and as well-rounded, high-potential technical

professionals.

Requirements

• Bachelor’s or Master’s degree in Engineering, Material Science, Statistics, or related fields.
• Minimum of 10 years of Mfg Engineering and Process / Technology Development experience for

PCBA and SI and minimum 5 years in management position.

• At least 5 years of experience in electronic manufacturing within a Contract Manufacturer (CM)

environment with a proven record.

• Knowledge and experience of PCBA with large size BGA (> 80 mm x 80 mm), Co-Packaged

Optics, Thermal Compression Bonding, High speed connector / flying cable, and Liquid Cooling are

preferable,

• Strong English communication skills (listening, speaking, reading, and writing) and excellent

interpersonal skill

• Ability to lead projects from beginning to end and drive initiatives with a global team.
• Ability to work under pressure.
• Work location is in Mexico.