Micron Technology
Builtin · Indexed 2026-08-01
Principal Process Engineer, Die Bonding
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Indexed description
Micron Technology Principal Process Engineer, Die Bonding Reposted 2 Hours AgoSaved In-Office Boise, ID, USA 150K-160K Annually Senior level 150K-160K Annually Senior levelArtificial Intelligence • Hardware • Information Technology • Machine LearningAs a Principal Process Engineer, you'll optimize die bonding processes, improve yield and cost, and resolve manufacturing issues while leading initiatives and collaborating with teams.Top Skills: 8DDoeFmeaSpc/Fdc
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