Micron Technology Builtin · Indexed 2026-06-20

Principal Engineer Advanced Package Technology Development

Boise, ID, USA

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Indexed description

Micron Technology Principal Engineer Advanced Package Technology Development Reposted 5 Hours AgoSaved In-Office Boise, ID, USA Senior level Senior levelArtificial Intelligence • Hardware • Information Technology • Machine LearningAs a Principal Engineer, you will innovate advanced semiconductor packaging technology, collaborate with partners, and guide strategic decisions to enhance competitive advantage.Top Skills: 2.5D Integration3D IntegrationHigh Bandwidth MemoryHybrid BondingWafer Level Packaging

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Micron Technology Company profile preview

Source: Builtin
Location: Boise, ID, USA
Compensation: Not listed
Open on Caio: 158 roles

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158open roles 2sources 7markets Posted yesterdaylatest role