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Micron Technology Builtin · Indexed 2026-08-23

Sr. Member Technical Staff - ESD and Latch-Up - HBM

Machine LearningDefine end-to-end ESD and latch-up architecture for next-generation HBM across base die 177K-334K Annually

Senior level Builtin
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Micron Technology Sr. Member Technical Staff - ESD and Latch-Up - HBM Reposted An Hour AgoSaved In-Office 2 Locations 177K-334K Annually Senior level 177K-334K Annually Senior levelArtificial Intelligence • Hardware • Information Technology • Machine LearningDefine end-to-end ESD and latch-up architecture for next-generation HBM across base die, DRAM stacks, TSVs, and advanced packaging. Develop protection strategies, standards, rule decks, and signoff criteria; correlate design assumptions with silicon validation and field reliability; and partner with foundry and packaging teams to solve system-level ESD challenges.Top Skills: 3D IcAdvanced PackagingDramEsdFinfetGaaHbmHigh-Speed I/OLatch-UpPdkTsv

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