Package, Assembly, Test (PAT) Team Lead

About Lyte AI

Lyte builds perception systems for Physical AI operating in complex environments. The company combines custom silicon, integrated sensors, and software into a unified platform for robotics, mobility, and next-generation automation. Lyte is headquartered in Sunnyvale, California, with a global presence. For more information, visit www.lyte.ai

If you’re excited about building impactful technology in a dynamic, hands-on environment, we’d love to hear from you!

About the role

• We are seeking an experienced engineering lead in device packaging, module mechanical assembly, PCBA and device test engineering leader with degree in Electrical Engineering, Photonics, Mechanical Engineer, or a related field.

What you'll do

• Lead Asia operation team working with OSATs, assemblyhouses, PCBA lines to support NPI and volume production.

• Working closely with HQRnDand operation team to implement wafer level probetestsat OSATs toidentifyknown good dies.

• Working with HQ team to support device packaging process improvement with Cp andCpkincrease.

• Work with HQ teams and our IIIV foundries to support wafer level process, bar level, and CoC process as well as CoC level test and qualification before and afterburnin.

• Work with HQ teams and our assembly houses to support module assembly and PCBA for NPI and volume production.

• Work with reliability engineers to implement the tests needed for wafer, devices, packaged devices, and systemreliability tests.

• Write technical documentation for test implementation,reports,and present results to internal and external stakeholders.

• Intime make technical and project decision.

• Participate in the process FMEA, process FA, and push to get 8D reports from contract manufactures

• Manage and expand the Asia operation team when needed.

Required Qualifications

• Minimal requirement is a bachelor's degree with12 yearsof experience.

• Device test knowledge and experience for at least some following areas for: IIIVCoC,wafer level probe test, packaged electro-optical devices, assembly modules, PCBA.

• Knowledge and experienceinat least some following processes: IIIV or CMOS wafer level process; IIIV bar level processes; device packaging processes such as die attach, flip chip, wire bonding, and module mechanical assembly processes, particularly camera and lidar moduleassembly.

• A fastlearner isa must.

• Good workethics andmaintainingthe company’sconfidential information area must.

Preferred Qualifications

• A higherdegree with more experience is highly desired.

• Experience on optoelectronic devicetestssuch as those for optical engines in pluggable modes and pluggablemodulesis a plus.

• Experience and knowledge ofsiliconphotonic devices and IIIV CoC reliability is a huge plus.

• Experience of the setup and implementation of tests for NPI and volume production is a big plus.

• Experienceintheprocess ofautomationand test automation is a plus.

• Data analysis experience such as JMPs is a plus;

Benefits (subject to location and local regulations)

• Competitive salary and equity
• Comprehensive medical, dental, and vision coverage
• 401(k) retirement plan
• Flexible vacation and time-off policy
• Collaborative, fast-paced, and inclusive work environment
• Opportunity to work on cutting-edge technologies with a highly cross-functional team

Originally posted on Himalayas