Technical Product Manager — AI Data Center Interconnect

Overview

Own the roadmap and product definition for next‑generation copper, optical, and RF interconnect solutions used in AI and hyperscale data centers. Combine system‑level technical depth with customer‑facing product leadership.

Responsibilities

• Define product strategy and requirements for high‑speed interconnects (copper, optical, RF).
• Translate customer needs into MRDs/PRDs and drive cross‑functional execution.
• Work with system architects, ASIC/xPU teams, board designers, and SI engineers.
• Support technologies including co‑packaged optics, near‑packaged optics/copper, and advanced interconnect architectures.
• Engage with hyperscalers, OEMs, and ecosystem partners to validate roadmaps and requirements.
• Develop technical collateral and support product launches.

Qualifications

• MS in Electrical Engineering or related field.
• 5–7 years in system design, cable/interconnect design, or technical product management.
• Strong understanding of signal integrity, high‑speed channels, and data‑center system architectures.
• Experience working with technical and commercial customer teams.
• Excellent communication and cross‑functional leadership skills.